Data Center Chip Market by Chip Type (GPU, ASIC, FPGA, CPU, and Others), Data Center Size (Small & Medium Size and Large Size) and Industry Vertical (BFSI, Manufacturing, Government, IT & Telecom, Retail, Transportation, Energy & Utilities, and Others): Global Opportunity Analysis and Industry Forecast, 2021 – 2027

ID: VPR/SEM/168 Publishing Year: January 2021 Pages: 142 Format:   


The Data Center Chip Market was valued at $ XX billion in 2019, and is expected to reach $ XX billion by 2027, registering a CAGR of XX% from 2021 to 2027.

A Data Center is a premise of networked computers and storage that organizations from various fields use to systematize, store, process massive amounts of data. It is usually found in the server area within the data server and depends heavily on the applications, service, and data to focus on the day to day activities.

Advancements in chip technology, cloud computing, government regulations, and high Data Center operations drive the growth of the market. However expensive operational costs and high Data Center operations restrain the market growth. As there is an increase in smart computing devices is expected to increase market growth in the future.

Segment Insight:

The Data Center Chip Market size is based on chip type, Data Center size, industry vertical. Based on the chip type, the market is classified into GPU, ASIC, FPGA, CPU, and others. Based on Data Center size, the market is segmented into small & medium size and large size. Based on industry vertical, the market is segmented into BFSI, manufacturing, government, IT & telecom, retail, transportation, energy & utilities, and others.

By Chip Type Insight:

Based on the chip type, the market is classified into GPU, ASIC, FPGA, CPU, and others. GPU ( Graphics Processing Unit) is used for 3D applications. It transforms the object and creates a lightning effect. ASIC (application-specific integrated circuit) is a microchip that is used for special applications such as hand-held computers. FPGA (Field-Programmable Gate Array) is a prefabricated silicon chip used for digital design. SRAM was the first static memory. CPU is an integrated circuit it is the primary processing component in the computer.

By Data Center Size Type Insight:

Based on Data Center size, the market is segmented into small & medium size and large size.

By Industry Vertical Type Insight:

Based on industry vertical, the market is classified into BFSI, manufacturing, government, IT & telecom, retail, transportation, energy & utilities and others.

Major Market Players of Data Center Chip Market

Intel Corporation, Global Foundries, Advanced Micro Devices, Inc, Taiwan Semiconductor Manufacturing Co. Ltd., Samsung Electronics Co. Ltd., Arm Limited (SoftBank Group Corp.), Broadcom, Xilinx, Inc., Huawei Technologies Co. Ltd., Nvidia Corporation. Most of the key players in Data Center Chip Market are focusing on business expansion to gain a higher revenue share through the adoption of strategies, such as mergers and acquisitions and new product development.

Data Center Chip Market Ke Segments:

By Chip Type:

  • GPU
  • ASIC
  • FPGA
  • CPU
  • Others

By Data Center Size:

  • Small & Medium Size
  • Large Size

By Industry Vertical:

  • BFSI
  • Manufacturing
  • Government
  • IT & Telecom
  • Retail
  • Transportation
  • Energy & Utilities
  • Others

By Region:

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Spain
    • Rest of Europe
  • Asia-Pacific
    • Japan
    • China
    • India
    • Australia
    • Rest of Asia-Pacific
  • LAMEA
    • Brazil
    • Argentina
    • Turkey
    • South Africa
    • Rest of LAMEA


Frequently Asked Questions
Intel Corporation, Global Foundries, Advanced Micro Devices, Inc, Taiwan Semiconductor Manufacturing Co. Ltd., Samsung Electronics Co. Ltd., Arm Limited (SoftBank Group Corp.), Broadcom, Xilinx, Inc., Huawei Technologies Co. Ltd., Nvidia Corporation are the Major Key Players in Data Center Chip Market.
Advancements in chip technology, cloud computing, government regulations are the Major Factors Driving the Data Center Chip Market.

TABLE OF CONTENTS:

CHAPTER 1 MARKET INTRODUCTION

1.1. REPORT OVERVIEW

1.2. SCOPE OF THE STUDY

1.3. PRIMARY MARKET SEGMENTS

1.4. RESEARCH METHODOLOGY

CHAPTER 2 EXECUTIVE SUMMARY

2.1. C-LEVEL EXECUTIVE’S OVERVIEW AND PERSPECTIVES

CHAPTER 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE

3.2. PRINCIPAL FINDINGS

3.2.1. Key investment pockets

3.2.2. Leading winning strategies

  3.2.3 Key Player Positioning

3.3. PORTERS FIVE FORCES OF COMPETITIVE ANALYSIS

 3.4. MARKET DYNAMICS

3.4.1. Drivers

3.4.2. Restraints

3.4.3. Opportunities

3.4.4. Impact Analysis

3.5. IMPACT OF COVID-19 ON THIS MARKET

CHAPTER 4  DATA CENTER CHIP MARKET , BY CHIP TYPE

4.1. SYNOPSIS

4.1.1. Market size and forecast

  4.2. GPU

4.2.1. Key market trends

4.2.2. Growth factors and opportunities

  4.2.3. Market size and forecast

4.3. ASIC

4.3.1. Key market trends

4.3.2. Growth factors and opportunities

  4.3.3. Market size and forecast

  4.4. FPGA

4.4.1. Key market trends

4.4.2. Growth factors and opportunities

  4.4.3. Market size and forecast

4.5. CPU

4.5.1. Key market trends

4.5.2. Growth factors and opportunities

  4.5.3. Market size and forecast

  4.6. OTHERS

4.6.1. Key market trends

4.6.2. Growth factors and opportunities

  4.6.3. Market size and forecast 

CHAPTER 5 DATA CENTER CHIP MARKET, BY SIZE

  • 5.1 SYNOPSIS 

5.1.1. Market size and forecast

  • 5.2 SMALL  

5.2.1. Key market trends

5.2.2. Growth factors and opportunities

5.2.3. Market size and forecast

  • 5.3 MEDIUM

5.3.1. Key market trends

5.3.2. Growth factors and opportunities

5.3.3. Market size and forecast

CHAPTER 6 DATA CENTER CHIP MARKET, BY INDUSTRY VERTICAL

  • 6.1. SYNOPSIS

6.1.1. Market size and forecast

  • 6.2. BFSI

6.2.1. Key market trends

6.2.2. Growth factors and opportunities

6.2.3. Market size and forecast

  • 6.3. MANUFACTURING

6.3.1. Key market trends

6.3.2. Growth factors and opportunities

6.3.3. Market size and forecast

  • 6.4. GOVERNMENT

6.4.1. Key market trends

6.4.2. Growth factors and opportunities

6.4.3. Market size and forecast

  • 6.5. IT & TELECOM

6.5.1. Key market trends

6.5.2. Growth factors and opportunities

6.5.3. Market size and forecast

  • 6.6. RETAIL

6.6.1. Key market trends

6.6.2. Growth factors and opportunities

6.6.3. Market size and forecast

  • 6.7. TRANSPORTATION

6.7.1. Key market trends

6.7.2. Growth factors and opportunities

  6.7.3. Market size and forecast

  • 6.8. ENERGY & UTILITIES

6.8.1. Key market trends

6.8.2. Growth factors and opportunities

  6.8.3. Market size and forecast

CHAPTER 8 DATA CENTER CHIP MARKET, BY REGION

8.1 SYNOPSIS

8.2 North America

8.2.1 Key market trends

8.2.2 Competitive scenario

8.2.3 Key growth factors and opportunities

8.2.4 Market size and forecast

8.3 Europe

8.3.1 Key market trends

8.3.2 Competitive scenario

8.3.3 Key growth factors and opportunities

8.3.4 Market size and forecast

8.4 Asia Pacific

8.4.1 Key market trends

8.4.2 Competitive scenario

8.4.3 Key growth factors and opportunities

8.4.4 Market size and forecast

8.5 LAMEA

8.5.1 Key market trends

8.5.2 Key growth factors and opportunities

8.5.3 Market size and forecast

CHAPTER 9 COMPANY PROFILES

  9.1. INTEL CORPORATION

9.1.1. Company overview

9.1.2. Company snapshot

9.1.3. Product portfolio

9.1.4. Business performance

9.1.5. Key strategic moves and developments

9.2. GLOBAL FOUNDRIES

9.2.1. Company overview

9.2.2. Company snapshot

9.2.3. Operating business segments

9.2.4. Product portfolio

9.2.5. Business performance

9.2.6. Key strategic moves and developments

9.3. ADVANCED MICRO DEVICES

9.3.1. Company overview

9.3.2. Company snapshot

9.3.3. Operating business segments

9.3.4. Product portfolio

9.3.5. Business performance

9.3.6. Key strategic moves and developments

9.4.  TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD

9.4.1. Company overview

9.4.2. Company snapshot

9.4.3. Operating business segments

9.4.4. Product portfolio

9.4.5. Business performance

9.4.6. Key strategic moves and developments

9.5. SAMSUNG ELECTRONICS CO. LTD

9.5.1. Company overview

9.5.2. Company snapshot

9.5.3. Operating business segments

9.5.4. Product portfolio

9.5.5. Business performance

9.5.6. Key strategic moves and developments

9.6. ARM LIMITED (SOFTBANK GROUP CORP.

9.6.1. Company overview

9.6.2. Company Snapshot

9.6.3. Operating business segments

9.6.4. Product portfolio

9.6.5. Business performance

9.6.6. Key strategic moves and developments

9.7. BROADCOM

9.7.1. Company overview

9.7.2. Company snapshot

9.7.3. Operating business segments

9.7.4. Product portfolio

9.7.5. Business performance

9.7.6. Key strategic moves and developments

9.8. XILINX, INC

9.8.1. Company overview

9.8.2. Company snapshot

9.8.3. Operating business segments

9.8.4. Product portfolio

9.8.5. Business performance

9.8.6. Key strategic moves and developments

9.9. HUAWEI TECHNOLOGIES CO. LTD

9.9.1. Company overview

9.9.2. Company snapshot

9.9.3. Operating business segments

9.9.4. Product portfolio

9.9.5. Business performance

9.9.6. Key strategic moves and developments

9.10. NVIDIA CORPORATION

9.10.1. Company overview

9.10.2. Company snapshot

9.10.3. Operating business segments

9.10.4. Product portfolio

9.10.5. Business performance

9.10.6. Key strategic moves and developments


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